Recently, in the joint laboratory of Eta Ursae Majoris Semiconductor (Zhejiang) Co., Ltd. (hereinafter referred to as “Eta Ursae Majoris”) and Moganshan Research Institute of Zhejiang University of Technology, the technicians of the enterprise are debugging a laser annealing equipment. In a few days, this equipment worth nearly 7 million yuan will be shipped to customers.
“From the signing of the contract in April this year to the realization of production, it took more than four months before and after, which can be said to be an acceleration.” Ye Zhongping, CEO of Eta Ursae Majoris Semiconductor (Zhejiang) Co., Ltd. said.
Eta Ursae Majoris is one of the landmark projects introduced by Moganshan Research Institute this year, mainly engaged in the research, development, production and sales of the third generation wide band gap semiconductor process equipment. At present, the company has completed the closed-loop temperature control system in Eta Ursae Majoris, and has a number of proprietary technologies such as laser annealing method on the back of Eta Ursae Majoris power chip, independent innovation of Eta Ursae Majoris SiC epitaxial growth scheme, inert gas barrier technology and so on.
“At present, we have realized the mass production of the company’s fist product, laser annealing equipment, with the choice of two modes: progressive annealing and local annealing, and are currently developing MOCVD epitaxial equipment.” Ye Zhongping introduced that in recent years, due to foreign restrictions on China’s export of semiconductor equipment and rising domestic demand, China’s semiconductor industry has been accelerating. In order to conform to the development trend of the industry and expand the domestic market, the company has been pursuing higher production efficiency and reliability in research and development.
It is not easy to seize the market. “Our laser annealing equipment has been able to achieve a production efficiency of 300 seconds.” Ye Zhongping confidently said that the beat time is 300 seconds, that is, the complete cycle from grabbing the wafer to completing the laser annealing of the chip is 300 seconds, which is ahead of other similar equipment and can effectively reduce the production cost for the enterprise. Not only that, under the wave of intelligent manufacturing, enterprises continue to expand investment in research and development, increase the intensity of independent innovation, and empower the localization of semiconductor industry. “It is expected that in the fourth quarter of this year, we will be able to complete the assembly of MOCVD epitaxial equipment and fill the gap in the domestic market.”
At present, the company is stepping up the layout of the production space of the Industrial Innovation Park of Moganshan Research Institute to expand production capacity, which is expected to be put into use in the fourth quarter of this year. “The first phase of the project here has set up a 1000-square-meter clean and dust-free workshop. In the second phase of the project, we have planned more than 2,500 square meters of 100-level, 1,000-level and 10,000-level clean workshops to meet the different production requirements of equipment.” Ye Zhongping said that in the future, the company will actively promote independent research and development, break through the shackles of core technologies, promote the industrial chain to move towards high-end manufacturing processes, and jointly create with chip R&D and manufacturing enterprises to jointly promote technological progress and innovation.
(Source: Huzhou Science and Technology Information Research Institute)